Packages / SOIC / TSSOP
14-lead 0.65 mm-pitch thin small-outline IC.
| Family | SOIC / TSSOP |
| Terminals | 14 |
| Pitch | 0.65 mm |
| Body (L × W) | 5 × 4.4 mm |
| Height | 1.1 mm |
| IPC land pattern | SOP65P640X120-14 |
| Also known as | TSSOP14 |
A thin, fine-pitch (0.65 mm) 14-lead package much smaller than SOIC. Common for logic and interface ICs; hand-solderable with drag technique.
The part's orientation in its carrier sets the pickup angle — the converter corrects that rotation for your machine.
Placement rotation
Parts in this package are typically taped at an orientation that needs a +270° correction from the community rotation table (TSSOP). The converter applies this to matching parts automatically — verify against your own footprint library.
Prepping a board with TSSOP-14 parts?
Convert a job for any machine →Dimensions are nominal for the family — verify against your part's datasheet.
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