Packages / SOIC / TSSOP
20-lead 0.65 mm-pitch shrink small-outline IC.
| Family | SOIC / TSSOP |
| Terminals | 20 |
| Pitch | 0.65 mm |
| Body (L × W) | 7.2 × 5.3 mm |
| Height | 2 mm |
| IPC land pattern | SOP65P780X200-20 |
| Also known as | SSOP20 |
A shrink SOIC (0.65 mm pitch) noticeably smaller than SOIC for the same pin count. Hand-solderable with flux and drag technique.
The part's orientation in its carrier sets the pickup angle — the converter corrects that rotation for your machine.
Placement rotation
Parts in this package are typically taped at an orientation that needs a +270° correction from the community rotation table (SSOP). The converter applies this to matching parts automatically — verify against your own footprint library.
Prepping a board with SSOP-20 parts?
Convert a job for any machine →Dimensions are nominal for the family — verify against your part's datasheet.
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