Packages / SOIC / TSSOP
16-lead 0.65 mm-pitch thermal TSSOP with exposed pad.
| Family | SOIC / TSSOP |
| Terminals | 16 |
| Pitch | 0.65 mm |
| Body (L × W) | 5 × 4.4 mm |
| Height | 1.1 mm |
| IPC land pattern | SOP65P640X120-16 |
| Also known as | HTSSOP16, TSSOP-16 EP, PowerPAD |
A thermally-enhanced TSSOP (PowerPAD) with an exposed bottom pad, used by motor drivers, LED drivers and audio amps. Solder the pad to copper.
The part's orientation in its carrier sets the pickup angle — the converter corrects that rotation for your machine.
Placement rotation
Parts in this package are typically taped at an orientation that needs a +270° correction from the community rotation table (HTSSOP). The converter applies this to matching parts automatically — verify against your own footprint library.
Prepping a board with HTSSOP-16 parts?
Convert a job for any machine →Dimensions are nominal for the family — verify against your part's datasheet.
SMTPlace uses essential cookies to work. With your consent we'd also use privacy-friendly analytics to improve it — read our cookie policy.