Packages / SOIC / TSSOP
28-lead 0.65 mm-pitch thermal TSSOP with exposed pad.
| Family | SOIC / TSSOP |
| Terminals | 28 |
| Pitch | 0.65 mm |
| Body (L × W) | 9.7 × 4.4 mm |
| Height | 1.1 mm |
| IPC land pattern | SOP65P640X120-28 |
| Also known as | HTSSOP28, TSSOP-28 EP, PowerPAD |
A longer thermally-enhanced TSSOP for higher-pin-count power and driver ICs; the exposed pad must reach a copper pour.
The part's orientation in its carrier sets the pickup angle — the converter corrects that rotation for your machine.
Placement rotation
Parts in this package are typically taped at an orientation that needs a +270° correction from the community rotation table (HTSSOP). The converter applies this to matching parts automatically — verify against your own footprint library.
Prepping a board with HTSSOP-28 parts?
Convert a job for any machine →Dimensions are nominal for the family — verify against your part's datasheet.
SMTPlace uses essential cookies to work. With your consent we'd also use privacy-friendly analytics to improve it — read our cookie policy.