Packages / SOIC / TSSOP
8-lead 1.27 mm-pitch small-outline package.
| Family | SOIC / TSSOP |
| Terminals | 8 |
| Pitch | 1.27 mm |
| Body (L × W) | 5.2 × 5.3 mm |
| Height | 2 mm |
| IPC land pattern | SOP127P530X200-8 |
| Also known as | SOP8, PSOP-8 |
A wider SOP-8 variant used for some power and flash ICs; the larger body improves thermal handling over a standard SOIC-8.
The part's orientation in its carrier sets the pickup angle — the converter corrects that rotation for your machine.
Placement rotation
Parts in this package are typically taped at an orientation that needs a +270° correction from the community rotation table (SOP (except SOP-18)). The converter applies this to matching parts automatically — verify against your own footprint library.
Prepping a board with SOP-8 (wide) parts?
Convert a job for any machine →Dimensions are nominal for the family — verify against your part's datasheet.
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