Packages / SOIC / TSSOP
20-lead 0.65 mm-pitch thermal TSSOP with exposed pad.
| Family | SOIC / TSSOP |
| Terminals | 20 |
| Pitch | 0.65 mm |
| Body (L × W) | 6.5 × 4.4 mm |
| Height | 1.1 mm |
| IPC land pattern | SOP65P640X120-20 |
| Also known as | HTSSOP20, TSSOP-20 EP, PowerPAD |
A thermally-enhanced TSSOP (PowerPAD) with an exposed bottom pad for heat, used by motor drivers and audio amps. Solder the pad to a copper pour.
The part's orientation in its carrier sets the pickup angle — the converter corrects that rotation for your machine.
Placement rotation
Parts in this package are typically taped at an orientation that needs a +270° correction from the community rotation table (HTSSOP). The converter applies this to matching parts automatically — verify against your own footprint library.
Prepping a board with HTSSOP-20 parts?
Convert a job for any machine →Dimensions are nominal for the family — verify against your part's datasheet.
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