Packages / SOIC / TSSOP
24-lead 0.65 mm-pitch shrink small-outline IC.
| Family | SOIC / TSSOP |
| Terminals | 24 |
| Pitch | 0.65 mm |
| Body (L × W) | 8.7 × 5.3 mm |
| Height | 2 mm |
| IPC land pattern | SOP65P780X200-24 |
| Also known as | SSOP24 |
A 24-lead SSOP for interface, driver and data-converter ICs in a compact footprint.
The part's orientation in its carrier sets the pickup angle — the converter corrects that rotation for your machine.
Placement rotation
Parts in this package are typically taped at an orientation that needs a +270° correction from the community rotation table (SSOP). The converter applies this to matching parts automatically — verify against your own footprint library.
Prepping a board with SSOP-24 parts?
Convert a job for any machine →Dimensions are nominal for the family — verify against your part's datasheet.
SMTPlace uses essential cookies to work. With your consent we'd also use privacy-friendly analytics to improve it — read our cookie policy.