Packages / QFN / DFN
8-pad very-thin small-outline no-lead package.
| Family | QFN / DFN |
| Terminals | 8 |
| Pitch | 1.27 mm |
| Body (L × W) | 6 × 5 mm |
| Height | 0.8 mm |
| IPC land pattern | SON127P600X500X80-8 |
| Also known as | WSON8, SON-8, USON-8 |
A leadless small-outline package (WSON/SON) frequently used for SPI flash memory and power ICs; a QFN-style exposed pad aids cooling.
The part's orientation in its carrier sets the pickup angle — the converter corrects that rotation for your machine.
Prepping a board with WSON-8 parts?
Convert a job for any machine →Dimensions are nominal for the family — verify against your part's datasheet.
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