Packages / QFN / DFN
32-lead 0.5 mm-pitch leadless quad package.
| Family | QFN / DFN |
| Terminals | 32 |
| Pitch | 0.5 mm |
| Body (L × W) | 5 × 5 mm |
| Height | 0.9 mm |
| IPC land pattern | QFN50P500X500X90-32 |
| Also known as | QFN32, VQFN-32, MLF-32 |
A 5 × 5 mm, 0.5 mm-pitch QFN for wireless SoCs, sensors and MCUs. The thermal pad must be soldered for both grounding and cooling.
The part's orientation in its carrier sets the pickup angle — the converter corrects that rotation for your machine.
Placement rotation
Parts in this package are typically taped at an orientation that needs a +90° correction from the community rotation table (QFN). The converter applies this to matching parts automatically — verify against your own footprint library.
Prepping a board with QFN-32 parts?
Convert a job for any machine →Dimensions are nominal for the family — verify against your part's datasheet.
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