Packages / QFN / DFN

WSON-6

6-pad very-thin small-outline no-lead package.

Family QFN / DFN
Terminals 6
Pitch 0.5 mm
Body (L × W) 2 × 2 mm
Height 0.8 mm
IPC land pattern SON50P200X200X80-6
Also known as WSON6, SON-6, UDFN-6

A tiny 2 × 2 mm leadless package for small power ICs, load switches and references; reflow with a stencil.

Working with it

Hand-soldering Reflow / hot-air
Commonly holds Microcontrollers, rf socs, sensors and power ics
Note Leadless: needs solder paste and reflow or hot air (contacts sit under the body). Has a thermal tab/pad — solder it to a copper pour for cooling.

Supplied in

The part's orientation in its carrier sets the pickup angle — the converter corrects that rotation for your machine.

Prepping a board with WSON-6 parts?

Convert a job for any machine →

Dimensions are nominal for the family — verify against your part's datasheet.

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