Packages / QFN / DFN

QFN-16

16-lead leadless quad package with thermal pad.

Family QFN / DFN
Terminals 16
Pitch 0.65 mm
Body (L × W) 4 × 4 mm
Height 0.9 mm
IPC land pattern QFN65P400X400X90-16
Also known as QFN16, VQFN-16, MLF-16

A 4 × 4 mm leadless quad package with a center thermal pad. No leads to inspect — needs a stencil and reflow; hot air works with practice.

Working with it

Hand-soldering Reflow / hot-air
Commonly holds Microcontrollers, rf socs, sensors and power ics
Note Leadless: needs solder paste and reflow or hot air (contacts sit under the body). Has a thermal tab/pad — solder it to a copper pour for cooling.

Supplied in

The part's orientation in its carrier sets the pickup angle — the converter corrects that rotation for your machine.

Placement rotation

Parts in this package are typically taped at an orientation that needs a +90° correction from the community rotation table (QFN). The converter applies this to matching parts automatically — verify against your own footprint library.

Prepping a board with QFN-16 parts?

Convert a job for any machine →

Dimensions are nominal for the family — verify against your part's datasheet.

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