Packages / QFN / DFN

DFN-8

8-lead dual-flat leadless package.

Family QFN / DFN
Terminals 8
Pitch 0.5 mm
Body (L × W) 3 × 3 mm
Height 0.9 mm
IPC land pattern DFN50P300X300X90-8
Also known as DFN8, VDFN-8, TDFN-8

A small 3 × 3 mm leadless package with contacts on two sides, common for power ICs and memory. Like QFN, it wants a stencil and reflow.

Working with it

Hand-soldering Reflow / hot-air
Commonly holds Microcontrollers, rf socs, sensors and power ics
Note Leadless: needs solder paste and reflow or hot air (contacts sit under the body). Has a thermal tab/pad — solder it to a copper pour for cooling.

Supplied in

The part's orientation in its carrier sets the pickup angle — the converter corrects that rotation for your machine.

Placement rotation

Parts in this package are typically taped at an orientation that needs a +270° correction from the community rotation table (DFN). The converter applies this to matching parts automatically — verify against your own footprint library.

Prepping a board with DFN-8 parts?

Convert a job for any machine →

Dimensions are nominal for the family — verify against your part's datasheet.

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