Packages / QFN / DFN

QFN-36

36-lead 0.5 mm-pitch leadless quad package.

Family QFN / DFN
Terminals 36
Pitch 0.5 mm
Body (L × W) 6 × 6 mm
Height 0.9 mm
IPC land pattern QFN50P600X600X90-36
Also known as QFN36, VQFN-36, MLF-36

A 6 × 6 mm QFN for MCUs, PMICs and RF SoCs; stencil + reflow recommended for the exposed pad.

Working with it

Hand-soldering Reflow / hot-air
Commonly holds Microcontrollers, rf socs, sensors and power ics
Note Leadless: needs solder paste and reflow or hot air (contacts sit under the body). Has a thermal tab/pad — solder it to a copper pour for cooling.

Supplied in

The part's orientation in its carrier sets the pickup angle — the converter corrects that rotation for your machine.

Placement rotation

Parts in this package are typically taped at an orientation that needs a +90° correction from the community rotation table (QFN). The converter applies this to matching parts automatically — verify against your own footprint library.

Prepping a board with QFN-36 parts?

Convert a job for any machine →

Dimensions are nominal for the family — verify against your part's datasheet.

More QFN / DFN