Packages / BGA / LGA
Wafer-level chip-scale package — bare-die balls.
| Family | BGA / LGA |
| Terminals | — |
| Pitch | 0.4 mm |
| Body (L × W) | — |
| Height | — |
| IPC land pattern | WLCSP |
| Also known as | WL-CSP, chip-scale package, DSBGA |
A wafer-level chip-scale package is essentially the bare die with solder balls directly on it, at 0.4–0.5 mm pitch. Tiny and demanding: precise stencil, reflow and gentle handling — no package protects the die.
The part's orientation in its carrier sets the pickup angle — the converter corrects that rotation for your machine.
Prepping a board with WLCSP (wafer-level CSP) parts?
Convert a job for any machine →Dimensions are nominal for the family — verify against your part's datasheet.
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