Packages / BGA / LGA

BGA-256 (1.0 mm)

256-ball 1.0 mm-pitch ball grid array.

Family BGA / LGA
Terminals 256
Pitch 1 mm
Body (L × W) 17 × 17 mm
Height 1.5 mm
IPC land pattern BGA256
Also known as BGA256, PBGA-256

A 17 × 17 mm ball grid array for processors and FPGAs; needs multilayer escape routing, careful reflow and X-ray inspection.

Working with it

Hand-soldering Reflow / hot-air
Commonly holds Processors, memory, fpgas and sensors
Note Leadless: needs solder paste and reflow or hot air (contacts sit under the body).

Supplied in

The part's orientation in its carrier sets the pickup angle — the converter corrects that rotation for your machine.

Prepping a board with BGA-256 (1.0 mm) parts?

Convert a job for any machine →

Dimensions are nominal for the family — verify against your part's datasheet.

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