Packages / BGA / LGA

TFBGA-64

64-ball 0.8 mm-pitch thin fine-pitch BGA.

Family BGA / LGA
Terminals 64
Pitch 0.8 mm
Body (L × W) 5 × 5 mm
Height 1 mm
IPC land pattern BGA64
Also known as TFBGA64, FBGA-64

A 5 × 5 mm thin BGA (0.8 mm ball pitch) common for memory and small SoCs; reflow and often X-ray to verify the hidden joints.

Working with it

Hand-soldering Reflow / hot-air
Commonly holds Processors, memory, fpgas and sensors
Note Leadless: needs solder paste and reflow or hot air (contacts sit under the body).

Supplied in

The part's orientation in its carrier sets the pickup angle — the converter corrects that rotation for your machine.

Prepping a board with TFBGA-64 parts?

Convert a job for any machine →

Dimensions are nominal for the family — verify against your part's datasheet.

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