Packages / BGA / LGA
Fine-pitch micro ball grid array (0.5 mm).
| Family | BGA / LGA |
| Terminals | — |
| Pitch | 0.5 mm |
| Body (L × W) | — |
| Height | — |
| IPC land pattern | BGA50 |
| Also known as | uBGA, FBGA, micro BGA |
A fine-pitch (0.5 mm) micro-BGA used for memory, SoCs and space-critical parts. Demands precise stencil, paste and reflow; escape routing usually needs multiple layers.
The part's orientation in its carrier sets the pickup angle — the converter corrects that rotation for your machine.
Prepping a board with µBGA / FBGA (0.5 mm pitch) parts?
Convert a job for any machine →Dimensions are nominal for the family — verify against your part's datasheet.
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