Packages / BGA / LGA
100-ball 0.8 mm-pitch ball grid array.
| Family | BGA / LGA |
| Terminals | 100 |
| Pitch | 0.8 mm |
| Body (L × W) | 9 × 9 mm |
| Height | 1.2 mm |
| IPC land pattern | BGA100 |
| Also known as | BGA100, PBGA-100, TFBGA-100 |
A 9 × 9 mm BGA (0.8 mm pitch) for MCUs, memory and small SoCs; needs stencil, reflow and usually X-ray to verify the hidden joints.
The part's orientation in its carrier sets the pickup angle — the converter corrects that rotation for your machine.
Prepping a board with BGA-100 (0.8 mm) parts?
Convert a job for any machine →Dimensions are nominal for the family — verify against your part's datasheet.
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