Packages / BGA / LGA

BGA (0.8 mm pitch)

Ball grid array with 0.8 mm ball pitch.

Family	BGA / LGA
Terminals	—
Pitch	0.8 mm
Body (L × W)	—
Height	—
IPC land pattern	BGA80
Also known as	ball grid array, PBGA

A ball grid array places solder balls under the body on an 0.8 mm grid (body size varies widely by part). Requires stencil, reflow and often X-ray to verify — not hand-solderable.

Working with it

Hand-soldering Reflow / hot-air

Commonly holds Processors, memory, fpgas and sensors

Note Leadless: needs solder paste and reflow or hot air (contacts sit under the body).

Supplied in

Tape & Reel Tray (JEDEC)

The part's orientation in its carrier sets the pickup angle — the converter corrects that rotation for your machine.

Prepping a board with BGA (0.8 mm pitch) parts?

Convert a job for any machine →

Dimensions are nominal for the family — verify against your part's datasheet.

More BGA / LGA

BGA-100 (0.8 mm) BGA-256 (1.0 mm) BGA-484 (FPGA, 1.0 mm) FBGA-96 (DDR memory) LGA-12 (sensor) LGA-14 (sensor) LGA-16 (sensor) LGA-28 (sensor) LGA-8 (sensor) TFBGA-64 WLCSP (wafer-level CSP) µBGA / FBGA (0.5 mm pitch)