Guides / Packages
SMD package sizes explained
From 0402 chips to QFN and BGA — what the names mean and which you can hand-solder.
SMD package names look like a secret code — 0402, SOT-23, QFN-48. Here's what they actually describe and how to choose.
Chip sizes (0402, 0603, 0805…)
Two-terminal passives use an imperial size code: 0402 means 0.04 × 0.02 inch (1.0 × 0.5 mm). Bigger numbers are bigger parts. 0603 and 0805 are easy to hand-solder; 0201 and 01005 really want a machine.
Leaded ICs (SOIC, QFP)
SOIC and QFP packages have gull-wing leads on a pitch, from 1.27 mm down to 0.4 mm. Wider pitch is easier to solder, and the leads are visible and reworkable.
Leadless (QFN, BGA)
QFN and BGA packages hide their contacts under the body, so they need solder paste and reflow (or hot air) — you can't touch the joints with an iron.
Picking a size to hand-solder
- ·Beginner — 0603 / 0805 chips, SOIC, SOT-23, through-hole
- ·Doable with practice — 0402, TSSOP, 0.5 mm QFP
- ·Reflow only — QFN, DFN, BGA, 0201 and smaller
Every size, with dimensions and hand-solder difficulty, is in the package reference and the size chart.
Ready to prep a board?
Convert a job for any machine →